Showing results: 301 - 313 of 313 items found.
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mPCIe-DIO-24S -
Acces I/O Products, Inc.
The mPCIe-DIO-24S is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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mPCIe-DIO-24A -
Acces I/O Products, Inc.
The mPCIe-DIO-24A is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI and PCI Express digital I/O cards, but also provides for advanced features enabled by the onboard FPGA logic.
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GX5150 -
Terotest Systems Ltd.
The GX5150 Series are high speed, 6U PXI, sequenced digital I/O instruments. The GX5150 master controller has 32 bits of I/O channels that supports test rates of up to 50 MHz and a vector depth of up to 128 Mb per pin. The GX5151 slave offers the same timing characteristics and multiple I/O level configurations when used in conjunction with the GX5150. The GX5150 can control up to 15 GX5151 boards using the same timing and sequencer.
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NI
Digital Modules for Remote I/O provide 24 V digital inputs or outputs and offer 1‐, 2‐, 3‐, and 4‐wire spring terminal connection options. You can use inputs as counters or standard digital inputs, and you can adjust filter time to improve measurement quality. Inputs can include a built‐in power supply for sensors. Output modules feature circuit and overload protection and can drive up to 500 mA per channel, up to 8 A per module.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Digital Module for Remote I/O from a NI real‐time controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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mPCIe-IDIO-8 -
Acces I/O Products, Inc.
The mPCIe-IDIO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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mPCIe-II-16 -
Acces I/O Products, Inc.
The mPCIe-II-16 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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mPCIe-IIRO-8 -
Acces I/O Products, Inc.
The mPCIe-IIRO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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D1 -
Virginia Panel Corporation
iDock Series connectors are a mass interconnect for use with automatic machine handlers. As VPC's most compact design, the D1 is compatible with a variety of hybrid I/O modules that include: power, coax, signal, vacuum, pneumatic, and high speed digital. Despite its compact size, the D1 can engage up to 160 signal contacts simultaneously. The iDock Series connectors are compatible with VPC's existing line of modules, contacts, and tools.
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PCI-9222/9223 -
ADLINK Technology Inc.
The ADLINK PCI-9222/PCI-9223 is a 16-bit, 16/32-CH, 250/500 KS/s high performance DAQ card with 8 different input ranges. It also features 2-CH 16-bit analog outputs capable of a 1 MS/s update rate, 2-CH encoder inputs, and programmable function I/O. The software-programmable function I/O supports a variety of applications, including TTL digital I/O, high-speed DIO, general-purpose timer/counter, pulse generation, and PWM output. Analog input, analog output, and function I/O at full speed simultaneously, and multiple cards can be synchronized through the SSI (System Synchronization Interface) bus if users need more channels than a single board can provide. Ideal for mixed-signal tests, laboratory research, and factory automation, PCI-9222/PCI-9223 is the best single-board solution on the market providing the best integration capability of multiple tasks with high performance and an affordable price.
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Series 6000 -
Pacific Instruments, Inc.
An innovative and fully integrated modular transducer conditioning, acquisition and control system, the Series 6000 has unparalleled performance and accuracy. From two to many thousands of channels, high & low speed, analog & digital, Series 6000 acquires measurement data from virtually all types of sensors and is fully customizable to fit the needs of any test facility. Large & small, AC & DC powered enclosures are available for nearly any test environment. Analog and digital I/O modules condition, amplify, filter and digitize signals from transducers. Turnkey and/or API software is available, helping facilities get up and running quickly.
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Pacific Instruments, Inc.
Series 6000 analog I/O modules condition, amplify, filter and digitize signals from virtually any transducer. All modules have conditioning & amplifier per channel and nearly all modules allow for setting bridge completion, shunt calibration, transducer power, gain, etc. individually per channel. Following the conditioning/amplifier stage, multi-pole Bessel or Butterworth analog filters are provided on each channel and can be set or bypassed individually by program control. A number of the modules include a high level analog output providing a conditioned/filtered output to a redundant, external A/D system. A 16-Bit Successive Approximation A/D follows the analog filter stage. Some modules use a single A/D with sample and hold while others have an A/D per channel. Sample rates are programmable per channel to easily accommodate mixing high and low speed measurements into a single data stream. Programmable hardware based warnings and alarms are included in the channel-by-channel architecture and are detected by digital output modules in the system, providing an ultra-low latency control capability directly from the data acquisition system.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
